Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging
Guoli Sun is currently pursuing a Ph.D. at Harbin Institute of Technology, where his research focuses on material and structural reliability in advanced electronic packaging, as well as the mechanical characterization and performance analysis of various materials.
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Guoli Sun is currently pursuing a Ph.D. at Harbin Institute of Technology, where his research focuses on material and structural reliability in advanced electronic packaging, as well as the mechanical characterization and performance analysis of various materials.
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